MS-20PLUS is a solvent, and water-free universal parquet adhesive.
Suitable for bonding engineered board and solid wood onto suitable indoor substrates.
 
CHARACTERISTICS:
 
Elastic
EC-1R PLUS label: very low emission
Ready to use, single component
Solvent free
Contains no water
Free of isocyanates
Easy to apply
Forms stable peaks once applied by a notched trowel or spreader comb
Rapid cure and build up of final bond strength
High final bond strength (according to EN14293)
Suitable for underfloor heating
Avoids staining of the hands

APPLICATIONS:
 
MS-20PLUS is a solvent, and water-free universal parquet adhesive based upon polymers. Suitable for indoor bonding of engineered boards ready to use parquet and solid wood.
Suitable for use on porous and non-porous substrates such as mosaic, anhydrite, concrete, screeds, wood, chipboard and OSB Board (large particle size chipboard) , including floors with underfloor heating and cooling.